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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
IT1 Series q High Speed, Matched-Impedance, Parallel Board-to-board Connector System
4. Mating Procedure
Follow the procedure described below.
Note: ? The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board.
? The Transmission Module cannot be exposed to heat temperatures of the soldering process.
Step 1
Receptacle Placement on the board –
stationary side
Assure that the orientation posts are aligned
with the holes on the board.
When specifying receptacle assemblies without
the orientation posts exercise extra caution to
assure correct orientation and connection with
the solder pads.
Step 2
Insertion of the Transmission Module
Fully insert the Transmission Module in the
board-installed receptacle assembly.
It is critical that the insertion is done straight
and uniformly.
Step 3
Mating/un-mating
Assure that the receptacle assembly is correctly
aligned with the Transmission Module.
Fully insert the receptacle assembly on the
Transmission Module.
It is critical that the insertion is done straight
and uniformly.
Step 4
Connection completed
A307
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